AI 聊天
Loading data for BESI.AS — first visit, this takes a few seconds.

BE Semiconductor Industries N.V.

BESI.AS · Amsterdam · USD

189.25 +5.15 (2.80%)

收盤價: Sep 14, 2026, 3:38 PM

市值
$13.93B
下次財報日期
Oct 22, 2026

BE Semiconductor Industries N.V.(BESI.AS)股價、分析與資料

內在價值

正在載入內在價值…

分析師預測

股票預測 →

分析師預測無法取得

12個月目標價 · n/a 位分析師

分析師共識: n/a

間隔:1D
正在載入K線和訊號…

財務表現

查看財務 →
營收 (ttm)
€733.8M
淨利(ttm)
€208.7M

正在載入...

最新財報

已通報較預期YoY 變更
營收€249.9Mn/a+73.34%
EPS€1.11-€0.03+177.50%

下次財報

盤中。

估計 · 升級 →

查看財報詳情 →

指標

買價
0
市值
13.9B
淨利(ttm)
209M
1.33
2.61
67.41
26.69
P/B (ttm)
24.81
P/S (ttm)
18.98
財報日期
Oct 22, 2026
賣價
0
成交量
426,209
20 日平均成交量
457,108
開盤價
182.80
前收盤價
184.10
當日區間
182.50 - 190.30
52 週範圍
112.55 - 328.40
股利
$1.58 (0.83%)
除息日
Apr 27, 2026
第 1 頁,共 2 頁

關於 BE Semiconductor Industries N.V.

查看公司資料 →
BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries in the Netherlands, Switzerland, Austria, Singapore, Malaysia, and internationally. It operates through three segments: Die Attach, Packaging, and Plating. The company offers single chip, multi chip, multi module, flip chip, epoxy and soft solder die bonding systems, hybrid, TCB and embedded bridge die bonding, die lid attach, and fan out wafer level packaging systems; and conventional, ultra-thin and wafer level molding, trim and form, and singulation systems. It also provides tin, copper, precious metal and solar plating systems, and related process chemicals; and tooling, conversion kits, spare parts, and other services. The company sells its products under the Fico, Meco, Datacon, and Esec brands. It serves multinational chip manufacturers, foundries, assembly subcontractors and electronics, and industrial companies. BE Semiconductor Industries N.V. was incorporated in 1995 and is headquartered in Duiven, the Netherlands. Semiconductor Equipment & Materials · Technology

BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries in the Netherlands, Switzerland, Austria, Singapore, Malaysia, and internationally. It operates through three segments: Die Attach, Packaging, and Plating. The company offers single chip, multi chip, multi module, flip chip, epoxy and soft solder die bonding systems, hybrid, TCB and embedded bridge die bonding, die lid attach, and fan out wafer level packaging systems; and conventional, ultra-thin and wafer level molding, trim and form, and singulation systems. It also provides tin, copper, precious metal and solar plating systems, and related process chemicals; and tooling, conversion kits, spare parts, and other services. The company sells its products under the Fico, Meco, Datacon, and Esec brands. It serves multinational chip manufacturers, foundries, assembly subcontractors and electronics, and industrial companies. BE Semiconductor Industries N.V. was incorporated in 1995 and is headquartered in Duiven, the Netherlands.

類股 Technology
IPO 日期 Jul 20, 1998
員工 1,952
證券交易所 Amsterdam
股票代號 BESI.AS