AI 聊天
Loading data for KLIC — first visit, this takes a few seconds.

Kulicke and Soffa Industries, Inc.

KLIC · NasdaqGS · USD

91.18 +2.71 (3.06%)

收盤價: Sep 25, 2026, 8:00 PM

91.40 +0.24%

盤後: 7:49 PM

市值
$4.77B
下次財報日期
Nov 18, 2026

Kulicke and Soffa Industries, Inc.(KLIC)股價、分析與資料

間隔:1D
正在載入K線和訊號…

內在價值

估值模型屬於 Pro 功能。登入或升級後可查看完整分析。

查看方案 →

分析師預測

股票預測 →

目標價

$100.00 – $115.00

中位數 $105.00 · 15.16% 上漲空間

12個月目標價 · 3 位分析師

分析師共識: n/a

您正在查看免費總覽

建立免費帳戶,探索更多關於此標的的研究資料。

財務表現

查看財務 →
營收 (ttm)
$950.2M

正在載入...

最新財報

已通報較預期YoY 變更
營收$330.4Mn/a+122.63%
EPS$1.20+$0.19+1614.29%

下次財報

盤中。

估計 · 升級 →

查看財報詳情 →

指標

買價
64.39
市值
4.77B
淨利(ttm)
116M
1.62
2.19
41.63
15.45
P/B (ttm)
5.23
P/S (ttm)
5.02
財報日期
Nov 18, 2026
賣價
113.49
成交量
464,023
20 日平均成交量
906,323
開盤價
89.50
前收盤價
88.47
當日區間
89.00 - 91.76
52 週範圍
35.02 - 135.80
目標價
105 (15.16%)
股利
$0.82 (0.90%)
除息日
Sep 17, 2026

關於 Kulicke and Soffa Industries, Inc.

查看公司資料 →
Kulicke and Soffa Industries, Inc. designs, manufactures, and sells capital equipment and consumables in China, the United States, Taiwan, Malaysia, Japan, the Philippines, Korea, Hong Kong, and internationally. It operates through four segments: Ball Bonding Equipment, Wedge Bonding Equipment, Advanced Solutions, and Aftermarket Products and Services (APS). The company provides services used to assemble semiconductor devices, such as integrated circuits, power discretes, light-emitting diode (LEDs), and sensors. It also offers ball bonding equipment, wafer level bonding equipment, and wedge and wedge-related bonding equipment; and advanced display, die-attach, and thermocompression systems and solutions, as well as tools, spares, and services for equipment. In addition, the company services, maintains, repairs, and upgrades equipment; and sells consumable aftermarket solutions and services. It serves integrated device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers, foundry service providers, and automotive electronics suppliers primarily in the United States and the Asia/Pacific region. The company was founded in 1951 and is headquartered in Singapore. Semiconductor Equipment & Materials · Technology

Kulicke and Soffa Industries, Inc. designs, manufactures, and sells capital equipment and consumables in China, the United States, Taiwan, Malaysia, Japan, the Philippines, Korea, Hong Kong, and internationally. It operates through four segments: Ball Bonding Equipment, Wedge Bonding Equipment, Advanced Solutions, and Aftermarket Products and Services (APS). The company provides services used to assemble semiconductor devices, such as integrated circuits, power discretes, light-emitting diode (LEDs), and sensors. It also offers ball bonding equipment, wafer level bonding equipment, and wedge and wedge-related bonding equipment; and advanced display, die-attach, and thermocompression systems and solutions, as well as tools, spares, and services for equipment. In addition, the company services, maintains, repairs, and upgrades equipment; and sells consumable aftermarket solutions and services. It serves integrated device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers, foundry service providers, and automotive electronics suppliers primarily in the United States and the Asia/Pacific region. The company was founded in 1951 and is headquartered in Singapore.

類股 Technology
IPO 日期 Feb 21, 1973
員工 2,551
證券交易所 NasdaqGS
股票代號 KLIC